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8 Layer Multilayer High Density Interconnect HDI PCB Board FR4 1.2mm Thickness

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8 Layer Multilayer High Density Interconnect HDI PCB Board FR4 1.2mm Thickness

Material : FR4

Minimum Hole Size : 0.1 mm

Minimum Line Spacing : 0.075 mm

Supply Ability : 1 Million Square feet/per month

Board Thickness : 1.2mm

Copper Thickness : 1/1/1/1/1/1/1/1 oz

Model Number : XSWPCB

Price : Negotiable

Minimum Line Width : 0.05 mm

Certification : UL ,IOS9000

Brand Name : XSW PCB

Place of Origin : China

Payment Terms : Western Union

MOQ : 1

Delivery Time : 8-15DAYS

Layer Count : 8-Layer

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Customizable High-Density Interconnect (HDI) PCB Boards

This product is tailor-made for industrial PLC automation control systems, delivering a reliable and smooth human-machine interaction (HMI) operating experience while providing a comprehensive application solution.

Key Specifications
Layer Count 8-Layer
Material FR4
Board Thickness 1.2mm
Copper Thickness 1/1/1/1/1/1/1/1 oz
Minimum Hole Size 0.1 mm
Minimum Line Width 0.05 mm
Minimum Line Spacing 0.075 mm
Solder Mask Color Green
Surface Finish OSP
Application Field High-Density Interconnect

Product Description
High-Density Interconnect (HDI) Technology

High-Density Interconnect (HDI) utilizes microvias with a diameter of ≤0.15 mm, employing advanced fine-line patterning and microvia formation techniques to achieve interconnection of components within an ultra-compact form factor. Its architectural design — characterized by minimized conductor geometries and optimized layer stacking — enables a wiring density that is an order of magnitude higher than that of conventional printed circuit boards (PCBs), making it essential for high-performance miniaturized systems.

Electrical performance is significantly enhanced through precise control of parasitic effects: residual stub inductance is reduced, discrete decoupling capacitors are eliminated via integrated power/ground planes, and crosstalk is minimized through controlled impedance routing. Furthermore, through the strategic placement of thin HDI dielectric layers, radiated electromagnetic interference (RFI/EMI) is lowered by minimizing loop inductance and uniformly distributing capacitance, thereby optimizing signal integrity along high-frequency transmission paths.

  • Design Specifications
Item Mass Production Capability Extreme Capability
Board Thickness Range 0.3~6.0mm 0.3~6.0mm
Exposure Alignment Accuracy ±0.015mm ±0.005mm
Minimum Annular Ring Single side ≥0.05mm Single side ≥0.05mm
Min Line Width/Space (1/3oz base copper) 0.05mm / 0.05mm 0.045mm / 0.045mm
Min Line Width/Space (1/2oz base copper) 0.05mm / 0.05mm 0.05mm / 0.05mm
Min Line Width/Space (1oz base copper) 0.075mm / 0.075mm 0.075mm / 0.075mm
Etching Tolerance (1/3oz base copper) ±0.005mm ±0.005mm
Etching Tolerance (1/2oz base copper) ±0.005mm ±0.005mm
Etching Tolerance (1oz base copper) ±0.0075mm ±0.0075mm
Gold Finger Total Pitch Tolerance <30mm: ±0.05mm
30~60mm: ±0.075mm		 <30mm: ±0.03mm
30~60mm: ±0.05mm

Product Tags:

8 Layer High Density Interconnect HDI PCB

      

High Density Interconnect HDI PCB Board

      

HDI Multilayer PCB FR4

      
Quality 8 Layer Multilayer High Density Interconnect HDI PCB Board FR4 1.2mm Thickness for sale

8 Layer Multilayer High Density Interconnect HDI PCB Board FR4 1.2mm Thickness Images

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