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Lead Free Tin Spraying Single Layer Printed Circuit Board Fast Prototype PCB Fabrication

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Lead Free Tin Spraying Single Layer Printed Circuit Board Fast Prototype PCB Fabrication

Name: Lead Free Tin Spraying Single Layer Printed Circuit Board Fast Prototype PCB Fabrication
Brand: XSW PCB
Price: 1 USD

Model Number : XSWPCB

Material : FR-4

MOQ : 1

Delivery Time : 8-15DAYS

Surface Finish : Lead-free tin spraying

Payment Terms : Western Union

Supply Ability : 1 Million Square feet/per month

Certification : UL ,IOS9000

Board Thickness : 0.5 mm (Customizable)

Place of Origin : China

Copper Thickness : 0.5 oz

Price : Negotiable

Brand Name : XSW PCB

Layer Count : 1-Layer

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Lead-free Tin Spraying Fast Prototype PCB Fabrication Single Layer

The Lead-Free Tin Spraying Fast Prototype Single Layer PCB is a cost-effective and reliable solution for rapid product development, electronic testing, and low-complexity circuit applications. Manufactured using environmentally friendly lead-free HASL (Hot Air Solder Leveling) surface treatment, this PCB provides excellent solderability, oxidation resistance, and compliance with RoHS environmental standards.

Key Specifications

Layer Count	1-Layer
Material	FR-4
Board Thickness	0.5 mm (Customizable)
Copper Thickness	0.5 oz
Minimum Hole Size	0.2 mm
Minimum Line Width	0.1 mm
Minimum Line Spacing	0.1 mm
Solder Mask Color	Green
Surface Finish	Lead-free tin spraying

Product Description

Fast Prototype Manufacturing
- Short production cycles accelerate product development and testing.
- Ideal for proof-of-concept, engineering validation, and functional prototypes.
Lead-Free HASL Surface Finish
- Environmentally friendly process compliant with RoHS requirements.
- Provides excellent solderability and strong solder joint reliability.
Single-Layer PCB Design
- Cost-effective solution for simple circuit applications.
- Easy to manufacture and assemble.
Excellent Solderability
- Uniform tin coating enhances component mounting performance.
- Compatible with manual soldering and automated assembly processes.
Reliable Electrical Performance
- Stable circuit conductivity and insulation characteristics.
- Suitable for low- to medium-complexity electronic designs.

Design Specifications

Item	Mass Production Capability	Extreme Capability
Board Thickness Range	0.3~6.0mm	0.3~6.0mm
Exposure Alignment Accuracy	±0.015mm	±0.005mm
Minimum Annular Ring	Single side ≥0.05mm	Single side ≥0.05mm
Min Line Width/Space (1/3oz base copper)	0.05mm / 0.05mm	0.045mm / 0.045mm
Min Line Width/Space (1/2oz base copper)	0.05mm / 0.05mm	0.05mm / 0.05mm
Min Line Width/Space (1oz base copper)	0.075mm / 0.075mm	0.075mm / 0.075mm
Etching Tolerance (1/3oz base copper)	±0.005mm	±0.005mm
Etching Tolerance (1/2oz base copper)	±0.005mm	±0.005mm
Etching Tolerance (1oz base copper)	±0.0075mm	±0.0075mm
Gold Finger Total Pitch Tolerance	<30mm: ±0.05mm 30~60mm: ±0.075mm	<30mm: ±0.03mm 30~60mm: ±0.05mm

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