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OEM 5G Communication Module Circuit Boards 12 Layer PCB Manufacturing Assembly

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OEM 5G Communication Module Circuit Boards 12 Layer PCB Manufacturing Assembly

Name: OEM 5G Communication Module Circuit Boards 12 Layer PCB Manufacturing Assembly
Brand: XSW PCB
Price: 1 USD

Model Number : XSWPCB

Material : FR4

MOQ : 1

Delivery Time : 8-15DAYS

Surface Finish : Lead-free soldering

Payment Terms : Western Union

Supply Ability : 1 Million Square feet/per month

Certification : UL ,IOS9000

Board Thickness : 2.5 mm (Customizable)

Place of Origin : China

Copper Thickness : 2/1/1/1/1/1/1/1/1/1/1/2 oz

Price : Negotiable

Brand Name : XSW PCB

Layer Count : 12-Layer

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5G Communication Module Oem Circuit Boards PCB Assembly Processing

5G Communication Module OEM Circuit Boards PCB Assembly Processing is a high-performance PCB assembly solution specifically developed for 5G communication modules, wireless networking equipment, IoT devices, telecommunications infrastructure, and high-speed data transmission systems. Designed to meet the stringent requirements of modern 5G technology, this PCB assembly service delivers excellent signal integrity, controlled impedance, low transmission loss, and superior reliability for next-generation communication applications.

Key Specifications

Layer Count	12-Layer
Material	FR4
Board Thickness	2.5 mm (Customizable)
Copper Thickness	2/1/1/1/1/1/1/1/1/1/1/2 oz
Minimum Hole Size	0.25 mm
Minimum Line Width	0.25 mm
Minimum Line Spacing	0.25 mm
Solder Mask Color	Green
Surface Finish	Lead-free soldering

Product Description

Designed for 5G Communication Applications

Optimized for high-speed wireless communication systems.
Supports 5G NR, LTE, Wi-Fi, and IoT communication technologies.
Suitable for next-generation networking equipment.

High-Speed Signal Integrity

Advanced PCB stack-up design for high-frequency signals.
Reduced signal attenuation and transmission loss.
Stable performance in high-bandwidth applications.

Controlled Impedance PCB Technology

Precise impedance control for RF and high-speed circuits.
Improved signal quality and transmission consistency.
Essential for 5G communication modules.

Advanced Multilayer PCB Construction

Supports complex high-density circuit designs.
Enhanced power distribution and signal isolation.
Suitable for compact communication devices.

High-Precision SMT Assembly

Automated placement for fine-pitch components.
Supports BGA, QFN, CSP, LGA, and RF packages.
High assembly accuracy and production efficiency.

Design Specifications

Item	Mass Production Capability	Extreme Capability
Board Thickness Range	0.3~6.0mm	0.3~6.0mm
Exposure Alignment Accuracy	±0.015mm	±0.005mm
Minimum Annular Ring	Single side ≥0.05mm	Single side ≥0.05mm
Min Line Width/Space (1/3oz base copper)	0.05mm / 0.05mm	0.045mm / 0.045mm
Min Line Width/Space (1/2oz base copper)	0.05mm / 0.05mm	0.05mm / 0.05mm
Min Line Width/Space (1oz base copper)	0.075mm / 0.075mm	0.075mm / 0.075mm
Etching Tolerance (1/3oz base copper)	±0.005mm	±0.005mm
Etching Tolerance (1/2oz base copper)	±0.005mm	±0.005mm
Etching Tolerance (1oz base copper)	±0.0075mm	±0.0075mm
Gold Finger Total Pitch Tolerance	<30mm: ±0.05mm 30~60mm: ±0.075mm	<30mm: ±0.03mm 30~60mm: ±0.05mm

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