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Immersion Gold PCB Multilayer Microwave RF Communication PCB Board

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Immersion Gold PCB Multilayer Microwave RF Communication PCB Board

Name: Immersion Gold PCB Multilayer Microwave RF Communication PCB Board
Brand: XSW PCB
Price: 1 USD

Model Number : XSWPCB

Material : FR4

MOQ : 1

Delivery Time : 8-15DAYS

Surface Finish : ENIG

Payment Terms : Western Union

Supply Ability : 1 Million Square feet/per month

Certification : UL ,IOS9000

Board Thickness : 1.2 mm (Customizable)

Place of Origin : China

Copper Thickness : 1/1/1/1 oz

Price : Negotiable

Brand Name : XSW PCB

Layer Count : 4-Layer

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Immersion Gold PCB Multilayer PCB Circuit Microwave Radio Frequency Communication Board

The Immersion Gold Multilayer PCB Circuit Board is specifically designed for microwave, radio frequency (RF), and high-speed communication applications. Manufactured using advanced multilayer PCB technology and premium high-frequency materials, this board delivers excellent signal integrity, low transmission loss, and superior electromagnetic compatibility for demanding wireless communication systems.

Key Specifications

Layer Count	4-Layer
Material	FR4
Board Thickness	1.2 mm (Customizable)
Copper Thickness	1/1/1/1 oz
Minimum Hole Size	0.1 mm
Minimum Line Width	0.1 mm
Minimum Line Spacing	0.1 mm
Solder Mask Color	Green
Surface Finish	ENIG

Product Description

Optimized for Microwave & RF Applications
- Designed for high-frequency signal transmission and microwave communication systems.
- Suitable for RF circuits operating in demanding communication environments.
Multilayer PCB Construction
- Supports complex signal routing and high-density circuit layouts.
- Dedicated power and ground planes improve signal stability and EMI suppression.
ENIG (Immersion Gold) Surface Finish
- Provides excellent solderability and flat surface characteristics.
- Enhances corrosion resistance and long-term electrical reliability.
Excellent Signal Integrity
- Controlled impedance design minimizes signal reflection and transmission loss.
- Supports high-speed and high-frequency communication protocols.
Low Insertion Loss
- High-frequency material options reduce attenuation in RF and microwave circuits.
- Improves overall communication efficiency.

Design Specifications

Item	Mass Production Capability	Extreme Capability
Board Thickness Range	0.3~6.0mm	0.3~6.0mm
Exposure Alignment Accuracy	±0.015mm	±0.005mm
Minimum Annular Ring	Single side ≥0.05mm	Single side ≥0.05mm
Min Line Width/Space (1/3oz base copper)	0.05mm / 0.05mm	0.045mm / 0.045mm
Min Line Width/Space (1/2oz base copper)	0.05mm / 0.05mm	0.05mm / 0.05mm
Min Line Width/Space (1oz base copper)	0.075mm / 0.075mm	0.075mm / 0.075mm
Etching Tolerance (1/3oz base copper)	±0.005mm	±0.005mm
Etching Tolerance (1/2oz base copper)	±0.005mm	±0.005mm
Etching Tolerance (1oz base copper)	±0.0075mm	±0.0075mm
Gold Finger Total Pitch Tolerance	<30mm: ±0.05mm 30~60mm: ±0.075mm	<30mm: ±0.03mm 30~60mm: ±0.05mm

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