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Taconic RF35 High Frequency Printed Circuit Board Custom Multilayer PCB

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Taconic RF35 High Frequency Printed Circuit Board Custom Multilayer PCB

Name: Taconic RF35 High Frequency Printed Circuit Board Custom Multilayer PCB
Brand: XSW PCB
Price: 1 USD

Model Number : XSWPCB

Material : Taconic RF-35

MOQ : 1

Delivery Time : 8-15DAYS

Surface Finish : ENIG

Payment Terms : Western Union

Supply Ability : 1 Million Square feet/per month

Certification : UL ,IOS9000

Board Thickness : 2.5 mm (Customizable)

Place of Origin : China

Copper Thickness : 2.5/1/1/1/1/1/1/1/1/1/1/1/1/1/1/1/1/2.5 oz

Price : Negotiable

Brand Name : XSW PCB

Layer Count : 18-Layer

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Taconic RF35 High Frequency PCB Multilayer Printed Circuit Board Custom

Taconic RF35 High Frequency PCB Multilayer Printed Circuit Board Custom is a premium low-loss RF PCB solution designed for high-frequency, microwave, millimeter-wave, and high-speed communication applications. Manufactured using Taconic RF-35 high-frequency laminate, this multilayer PCB delivers excellent electrical stability, low dielectric loss, superior signal integrity, and reliable performance in demanding RF environments.

Taconic RF-35 material features a dielectric constant (Dk) of approximately 3.5 and a low dissipation factor (Df), making it ideal for controlled impedance circuits, RF power amplifiers, antennas, filters, couplers, and wireless communication systems. The stable dielectric properties help minimize signal attenuation, phase distortion, and insertion loss across a wide frequency range.

Key Specifications

Layer Count	18-Layer
Material	Taconic RF-35
Board Thickness	2.5 mm (Customizable)
Copper Thickness	2.5/1/1/1/1/1/1/1/1/1/1/1/1/1/1/1/1/2.5 oz
Minimum Hole Size	0.1 mm
Minimum Line Width	0.1 mm
Minimum Line Spacing	0.1 mm
Solder Mask Color	Blue
Surface Finish	ENIG

Product Description

Premium Taconic RF-35 High-Frequency Material

Dielectric constant (Dk) approximately 3.5.
Low dissipation factor for reduced signal loss.
Excellent electrical stability at high frequencies.

Outstanding RF Performance

Optimized for RF, microwave, and millimeter-wave applications.
Low insertion loss and signal attenuation.
Improved transmission efficiency.

Superior Signal Integrity

Stable impedance characteristics.
Reduced crosstalk and electromagnetic interference (EMI).
Reliable high-speed signal transmission.

Advanced Multilayer PCB Structure

Supports complex multilayer stack-ups.
Enhanced routing density and signal isolation.
Suitable for compact RF designs.

Controlled Impedance Manufacturing

Precise impedance control for RF transmission lines.
Consistent electrical performance across production batches.
Ideal for antenna and communication systems.

Design Specifications

Item	Mass Production Capability	Extreme Capability
Board Thickness Range	0.3~6.0mm	0.3~6.0mm
Exposure Alignment Accuracy	±0.015mm	±0.005mm
Minimum Annular Ring	Single side ≥0.05mm	Single side ≥0.05mm
Min Line Width/Space (1/3oz base copper)	0.05mm / 0.05mm	0.045mm / 0.045mm
Min Line Width/Space (1/2oz base copper)	0.05mm / 0.05mm	0.05mm / 0.05mm
Min Line Width/Space (1oz base copper)	0.075mm / 0.075mm	0.075mm / 0.075mm
Etching Tolerance (1/3oz base copper)	±0.005mm	±0.005mm
Etching Tolerance (1/2oz base copper)	±0.005mm	±0.005mm
Etching Tolerance (1oz base copper)	±0.0075mm	±0.0075mm
Gold Finger Total Pitch Tolerance	<30mm: ±0.05mm 30~60mm: ±0.075mm	<30mm: ±0.03mm 30~60mm: ±0.05mm

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