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High Density 8 Layer 2+N+2 HDI PCB Manufacturing Process With Black Solder Resist OSP Coating

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High Density 8 Layer 2+N+2 HDI PCB Manufacturing Process With Black Solder Resist OSP Coating

Model Number : XSWPCB

Material : FR-4 TG150

MOQ : 1

Delivery Time : 8-15DAYS

Payment Terms : Western Union

Supply Ability : 1 Million Square feet/per month

Certification : UL ,IOS9000

Board Thickness : 1.2mm (Customizable)

Place of Origin : China

Copper Thickness : 2/1/1/1/1/1/1/2 oz

Price : Negotiable

Brand Name : XSW PCB

Layer Count : 8-Layer

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High-Density 8 Layer 2+N+2 HDI PCB Manufacturing with Black Solder Resist and OSP Coating

Custom 8 Layer 2+N+2 HDI PCB with Black Solder Mask and OSP Finish is engineered for high-density, miniaturized electronic devices that demand superior routing capability, precise interconnection, and reliable solderability. The board utilizes advanced two-step HDI technology with stacked laser microvias, enabling higher circuit density and optimized signal transmission for complex electronic designs.

Key Specifications
Layer Count 8-Layer
Material FR-4 TG150
Board Thickness 1.2 mm (Customizable)
Copper Thickness 2/1/1/1/1/1/1/2 oz
Minimum Hole Size 0.1 mm
Minimum Line Width 0.075 mm
Minimum Line Spacing 0.075 mm
Solder Mask Color Black
Surface Finish Immersion Gold (ENIG)

Product Description

Advanced 8-layer HDI multilayer circuit board customization, supporting 1st-order, 2nd-order and stacked microvia structures to realize ultra-compact PCB layout for miniaturized electronic products.

Precision micro-processing capability: capable of ultra-fine line width/space, tiny microvias and ultra-thin finished board thickness with strict dimensional tolerance control.

Multiple customizable surface finishes available, including ENIG, OSP, HASL, Immersion Silver and Hard Gold to match different soldering, conductivity and anti-corrosion requirements.

Strict impedance control, high-speed signal integrity optimization and reliable thermal performance design for high-frequency, high-power industrial and consumer electronic equipment.

Full one-stop OEM service covering DFM design review, prototype sampling, small batch trial run and large-scale mass production.

Complete quality inspection system: AOI, AXI, electrical continuity test, thermal cycling test and reliability aging test to guarantee long-term stable product performance.

  • Design Specifications
Item Mass Production Capability Extreme Capability
Board Thickness Range 0.3~6.0mm 0.3~6.0mm
Exposure Alignment Accuracy ±0.015mm ±0.005mm
Minimum Annular Ring Single side ≥0.05mm Single side ≥0.05mm
Min Line Width/Space (1/3oz base copper) 0.05mm / 0.05mm 0.045mm / 0.045mm
Min Line Width/Space (1/2oz base copper) 0.05mm / 0.05mm 0.05mm / 0.05mm
Min Line Width/Space (1oz base copper) 0.075mm / 0.075mm 0.075mm / 0.075mm
Etching Tolerance (1/3oz base copper) ±0.005mm ±0.005mm
Etching Tolerance (1/2oz base copper) ±0.005mm ±0.005mm
Etching Tolerance (1oz base copper) ±0.0075mm ±0.0075mm
Gold Finger Total Pitch Tolerance <30mm: ±0.05mm
30~60mm: ±0.075mm		 <30mm: ±0.03mm
30~60mm: ±0.05mm

Product Tags:

HDI PCB Manufacturing Process

      

High Density HDI PCB OSP Coating

      

8 Layer High Density HDI PCB

      
Quality High Density 8 Layer 2+N+2 HDI PCB Manufacturing Process With Black Solder Resist OSP Coating for sale

High Density 8 Layer 2+N+2 HDI PCB Manufacturing Process With Black Solder Resist OSP Coating Images

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