Home > HDI Printed Circuit Board >

12 Layer Multilayer HDI Printed Circuit Board High Density Electronics PCB Manufacturing

Product Categories

Single Layer Printed Circuit Board [10]
Double Layer Printed Circuit Board [10]
Multilayer Printed Circuit Board [17]
HDI Printed Circuit Board [10]
High Frequency Printed Circuit Board [12]
Server PCB [8]
Communication PCB [14]
Industrial Control PCB [10]
Copper Substrate PCB [2]
Medical Circuit Board [6]
Automotive Printed Circuit Board [6]
Drone PCB Board [5]
5G Optical Module PCB [5]
Radio Frequency PCB [5]

Shenzhen Xunsiwei Circuit Co., Ltd.

Trust Seal

Verified Supplier

Credit Check

Supplier Assessment

Contact Now

12 Layer Multilayer HDI Printed Circuit Board High Density Electronics PCB Manufacturing

Name: 12 Layer Multilayer HDI Printed Circuit Board High Density Electronics PCB Manufacturing
Brand: XSW PCB
Price: 1 USD

Model Number : XSWPCB

Material : FR-4

MOQ : 1

Delivery Time : 8-15DAYS

Surface Finish : OSP

Payment Terms : Western Union

Supply Ability : 1 Million Square feet/per month

Certification : UL ,IOS9000

Board Thickness : 1.0mm (Customizable)

Place of Origin : China

Copper Thickness : 1/1/1/1/1/1/1/1/1/1oz

Price : Negotiable

Brand Name : XSW PCB

Layer Count : 12-Layer

Contact Now

12 Layer Multilayer HDI PCB with Stacked Blind Vias for High-Density Electronics

The manufacturing process focuses on precise dual-laser alignment control. First- and second-stage blind vias are formed through sequential laser drilling, with cumulative microvia offset maintained within ≤25μm. Each laser drilling system is monitored through Statistical Process Control, maintaining a process capability index (CPK) of ≥1.33 to ensure consistent production quality.

To optimize black solder mask performance, exposure energy grid testing is conducted before production. The process ensures complete development and eliminates residue inside blind vias, preventing reliability issues during assembly.

Key Specifications

Layer Count	12-Layer
Material	FR-4
Board Thickness	1.0 mm (Customizable)
Copper Thickness	2/1/1/1/1/1/1/1/1/1/1/2 oz
Minimum Hole Size	0.1 mm
Minimum Line Width	0.1 mm
Minimum Line Spacing	0.1 mm
Solder Mask Color	Black
Surface Finish	OSP

Product Description

Advanced 2+N+2 HDI Structure

Two-step HDI architecture with stacked laser microvias.
Higher routing density for complex multilayer designs.
Supports miniaturized and high-performance electronic products.

Precision Dual-Laser Alignment Control

Sequential laser drilling process for stacked blind vias.
Cumulative blind-via offset controlled within ≤25μm.
Improves interconnection reliability and electrical performance.

High Process Capability Manufacturing

Laser drilling equipment maintained at CPK ≥1.33.
Stable production consistency across volume manufacturing.
Reduced variation and improved yield rates.

Black Solder Mask Optimization

Professional exposure energy grid testing before production.
Enhanced process control for black solder resist applications.
Suitable for high-density circuit patterns and fine-pitch designs.

Design Specifications

Item	Mass Production Capability	Extreme Capability
Board Thickness Range	0.3~6.0mm	0.3~6.0mm
Exposure Alignment Accuracy	±0.015mm	±0.005mm
Minimum Annular Ring	Single side ≥0.05mm	Single side ≥0.05mm
Min Line Width/Space (1/3oz base copper)	0.05mm / 0.05mm	0.045mm / 0.045mm
Min Line Width/Space (1/2oz base copper)	0.05mm / 0.05mm	0.05mm / 0.05mm
Min Line Width/Space (1oz base copper)	0.075mm / 0.075mm	0.075mm / 0.075mm
Etching Tolerance (1/3oz base copper)	±0.005mm	±0.005mm
Etching Tolerance (1/2oz base copper)	±0.005mm	±0.005mm
Etching Tolerance (1oz base copper)	±0.0075mm	±0.0075mm
Gold Finger Total Pitch Tolerance	<30mm: ±0.05mm 30~60mm: ±0.075mm	<30mm: ±0.03mm 30~60mm: ±0.05mm

Product Tags: