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Aerospace Multilayer PCBA 6 Layers Printed Circuit Board Prototype PCB Assembly

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Shenzhen Xunsiwei Circuit Co., Ltd.

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Aerospace Multilayer PCBA 6 Layers Printed Circuit Board Prototype PCB Assembly

Name: Aerospace Multilayer PCBA 6 Layers Printed Circuit Board Prototype PCB Assembly
Brand: XSW PCB
Price: 1 USD

Model Number : XSWPCB

Material : FR4

MOQ : 1

Delivery Time : 8-15DAYS

Minimum Hole Size : 0.2mm

Payment Terms : Western Union

Solder Mask Color : Green

Supply Ability : 1 Million Square feet/per month

Certification : UL ,IOS9000

Board Thickness : 1.8mm

Place of Origin : China

Copper Thickness : 1/1/1/1/1/1 oz

Price : Negotiable

Minimum Line Width : 0.1mm

Brand Name : XSW PCB

Layer Count : 6 Layers

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Aerospace Multilayer PCBA 6 Layers Printed Circuit Board Prototype PCB Assembly

Key Specifications

Layer Count	6 Layers
Material	FR4
Board Thickness	1.8mm
Copper Thickness	1/1/1/1/1/1 oz
Minimum Hole Size	0.2mm
Minimum Line Width	0.1mm
Minimum Line Spacing	0.1mm
Solder Mask Color	Green
Surface Finish	Lead-Free HASL (Tin Spray)
Application Field	Industrial Control and Automation Systems

We supply high-reliability 6-layer multilayer PCBA prototype and low-to-medium volume assembly solutions specially designed for aerospace applications. Our aerospace-grade 6-layer printed circuit boards adopt high-performance base materials, controlled impedance design, precise blind/buried vias technology and strict manufacturing procedures to withstand harsh operating environments including wide temperature fluctuation, vibration and low air pressure.
We provide full turnkey service covering PCB fabrication, high-grade component sourcing, precision SMT assembly, BGA soldering, reliability testing and dimensional verification. All production follows rigorous IPC aerospace standards, supporting strict traceability requirements. These 6-layer aerospace PCBs are widely used in satellite modules, aviation control systems, airborne communication equipment, flight sensor units and aerospace testing instruments. Prototype validation, engineering trial runs and formal batch production are available.

Key Manufacturing Features

1.Professional 6-layer multilayer PCB construction optimized for aerospace high-reliability scenarios
2.Support controlled impedance, microvias, blind and buried via aerospace circuit designs
3.High performance low Dk/Df substrate options, outstanding thermal and mechanical stability
4.Precision PCBA assembly for high-end chips, BGA, QFN and fine-pitch components
5.Complete turnkey service: PCB manufacturing, component procurement, SMT/DIP assembly & functional testing
6.Strict manufacturing compliance with IPC-6012, IPC-A-610 aerospace specifications
7.Excellent resistance to extreme temperature cycling, shock and vibration
8.Full production traceability available to meet aerospace industry audit requirements
9.Multiple high-reliability surface finishes: Hard immersion gold, soft gold, ENEPIG
10.Accept prototype samples, engineering prototypes and small batch aerospace orders

Technical Specifications

Item	Mass Production Capability	Extreme Capability
Board Thickness Range	0.3~6.0mm	0.3~6.0mm
Exposure Alignment Accuracy	±0.015mm	±0.005mm
Minimum Annular Ring	Single side ≥0.05mm	Single side ≥0.05mm
Min Line Width/Space (1/3oz base copper)	0.05mm / 0.05mm	0.045mm / 0.045mm
Min Line Width/Space (1/2oz base copper)	0.05mm / 0.05mm	0.05mm / 0.05mm
Min Line Width/Space (1oz base copper)	0.075mm / 0.075mm	0.075mm / 0.075mm
Etching Tolerance (1/3oz base copper)	±0.005mm	±0.005mm
Etching Tolerance (1/2oz base copper)	±0.005mm	±0.005mm
Etching Tolerance (1oz base copper)	±0.0075mm	±0.0075mm
Gold Finger Total Pitch Tolerance	<30mm: ±0.05mm 30~60mm: ±0.075mm	<30mm: ±0.03mm 30~60mm: ±0.05mm

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