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Polyimide Thick Copper Substrate PCB Multilayer PCB Fabrication Service ODM

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Polyimide Thick Copper Substrate PCB Multilayer PCB Fabrication Service ODM

Name: Polyimide Thick Copper Substrate PCB Multilayer PCB Fabrication Service ODM
Brand: XSW PCB
Price: 1 USD

Model Number : XSWPCB

Material : Polyimide

MOQ : 1

Delivery Time : 8-15DAYS

Surface Finish : ENIG

Payment Terms : Western Union

Place of Origin : China

Copper Thickness : 4/2/2/2/2/2/2/2/2/2/2/2/2/4 oz

Supply Ability : 1 Million Square feet/per month

Certification : UL ,IOS9000

Board Thickness : 1.5 mm (Customizable)

Price : Negotiable

Brand Name : XSW PCB

Layer Count : 14-Layer

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Polyimide Thick Copper PCB Substrate Multilayer Board Fabrication Service ODM

Polyimide Thick Copper PCB Substrate Multilayer Board Fabrication Service ODM is a high-performance PCB manufacturing solution designed for applications requiring exceptional thermal resistance, high current capacity, mechanical durability, and long-term reliability. Utilizing premium Polyimide (PI) substrate materials combined with thick copper technology, this multilayer PCB is ideal for power electronics, industrial automation, aerospace systems, electric vehicles, renewable energy equipment, and other mission-critical applications.

Key Specifications

Layer Count	14-Layer
Material	Polyimide
Board Thickness	1.5 mm (Customizable)
Copper Thickness	4/2/2/2/2/2/2/2/2/2/2/2/2/4 oz
Minimum Hole Size	0.2 mm
Minimum Line Width	0.25 mm
Minimum Line Spacing	0.25 mm
Solder Mask Color	Green
Surface Finish	ENIG

Product Description

Premium Polyimide Substrate Material

Excellent thermal resistance and dimensional stability.
Superior performance in high-temperature environments.
Ideal for aerospace, automotive, and industrial applications.

Thick Copper Technology

Enhanced current-carrying capability.
Reduced conductor resistance and voltage drop.
Suitable for high-power electronic systems.

Multilayer PCB Construction

Supports complex circuit architectures.
Improved signal routing and power distribution.
High-density design capability.

Outstanding Thermal Management

Efficient heat dissipation for power-intensive applications.
Improved reliability under continuous operation.
Reduced thermal stress on components.

Design Specifications

Item	Mass Production Capability	Extreme Capability
Board Thickness Range	0.3~6.0mm	0.3~6.0mm
Exposure Alignment Accuracy	±0.015mm	±0.005mm
Minimum Annular Ring	Single side ≥0.05mm	Single side ≥0.05mm
Min Line Width/Space (1/3oz base copper)	0.05mm / 0.05mm	0.045mm / 0.045mm
Min Line Width/Space (1/2oz base copper)	0.05mm / 0.05mm	0.05mm / 0.05mm
Min Line Width/Space (1oz base copper)	0.075mm / 0.075mm	0.075mm / 0.075mm
Etching Tolerance (1/3oz base copper)	±0.005mm	±0.005mm
Etching Tolerance (1/2oz base copper)	±0.005mm	±0.005mm
Etching Tolerance (1oz base copper)	±0.0075mm	±0.0075mm
Gold Finger Total Pitch Tolerance	<30mm: ±0.05mm 30~60mm: ±0.075mm	<30mm: ±0.03mm 30~60mm: ±0.05mm

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