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4 Layer Immersion Gold Multi PCB Circuit Boards For Communication Handsets

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4 Layer Immersion Gold Multi PCB Circuit Boards For Communication Handsets

Place of Origin : China

Material : FR4 TG170

Minimum Hole Size : 0.2 mm

Payment Terms : Western Union

Price : Negotiable

Board Thickness : 1.2 mm

Model Number : XSWPCB

Copper Thickness : 1/1/1/1 oz

Brand Name : XSW PCB

Minimum Line Spacing : 0.1 mm

Supply Ability : 1 Million Square feet/per month

MOQ : 1

Minimum Line Width : 0.1 mm

Layer Count : 4

Certification : UL ,IOS9000

Delivery Time : 8-15DAYS

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4-Layer PCB Motherboard for Mobile Communication Devices

This product is specifically designed for communication mobile phones, aiming to provide a stable and reliable user experience as well as efficient application solutions.

Key Specifications
Layer Count 4
Material FR4 TG170
Board Thickness 1.2 mm
Copper Thickness 1/1/1/1 oz
Minimum Hole Size 0.2 mm
Minimum Line Width 0.1 mm
Minimum Line Spacing 0.1 mm
Solder Mask Color Green
Surface Finish ENIG (Electroless Nickel Immersion Gold)
Application Field Mobile phone communication
Product Features
  • 4-Layer Precision Impedance Design ensures optimized and stable signal transmission
  • All buttons adopt ENIG (Immersion Gold) process for improved sensitivity and durability
  • Comprehensive Quality Control System covering various rigorous inspections and electrical functional testing
  • Communication-Grade Design guarantees smooth and stable daily use
  • PCB Solutions tailored specifically for the communication handset sector

We provide one-stop PCB solutions for the communication field, integrating material grading, precision manufacturing, full-process inspection, and environmental adaptability to meet long-term stable operation requirements.

Advantages of Custom PCB Solutions
  • Highly Customizable: Supports customization of dimensions, thickness, layer count, and various functional requirements to flexibly meet diverse application needs
  • High-Performance Materials: Utilizes FR-4 and medium-to-high TG materials, offering excellent heat resistance, moisture resistance, and long-term stability
  • Superior Reliability: Features high dielectric strength, robust voltage withstand capability, and excellent anti-interference performance, ensuring stable operation even in harsh environments
  • Professional Surface Finishes: Provides options such as ENIG, lead-free HASL, and OSP to ensure excellent solderability and long-term reliability
Technical Specifications
Item Mass Production Capability Extreme Capability
Board Thickness Range 0.3~6.0mm 0.3~6.0mm
Exposure Alignment Accuracy ±0.015mm ±0.005mm
Minimum Annular Ring Single side ≥0.05mm Single side ≥0.05mm
Min Line Width/Space (1/3oz base copper) 0.05mm / 0.05mm 0.045mm / 0.045mm
Min Line Width/Space (1/2oz base copper) 0.05mm / 0.05mm 0.05mm / 0.05mm
Min Line Width/Space (1oz base copper) 0.075mm / 0.075mm 0.075mm / 0.075mm
Etching Tolerance (1/3oz base copper) ±0.005mm ±0.005mm
Etching Tolerance (1/2oz base copper) ±0.005mm ±0.005mm
Etching Tolerance (1oz base copper) ±0.0075mm ±0.0075mm
Gold Finger Total Pitch Tolerance <30mm: ±0.05mm
30~60mm: ±0.075mm		 <30mm: ±0.03mm
30~60mm: ±0.05mm

Product Tags:

4 Layer Multi PCB

      

Immersion Gold Multi PCB

      

4 Layer Multi Circuit Boards

      
Quality 4 Layer Immersion Gold Multi PCB Circuit Boards For Communication Handsets for sale

4 Layer Immersion Gold Multi PCB Circuit Boards For Communication Handsets Images

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