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6 Layer ENIG Communication Module PCB For High Frequency Signal Transmission

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6 Layer ENIG Communication Module PCB For High Frequency Signal Transmission

Name: 6 Layer ENIG Communication Module PCB For High Frequency Signal Transmission
Brand: XSW PCB
Price: 1 USD

Material : FR4 TG150

Minimum Hole Size : 0.2

Brand Name : XSW PCB

Payment Terms : Western Union

Certification : UL ,IOS9000

Copper Thickness : 1/0.5/0.5/1 oz

Supply Ability : 1 Million Square feet/per month

Price : Negotiable

Model Number : XSWPCB

Board Thickness : 1.2mm

Minimum Line Width : 0.12mm

Place of Origin : China

Delivery Time : 8-15DAYS

Layer Count : 6 L

MOQ : 1

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6-layer ENIG Communication Equipment Module

This high-performance 6-layer communication module is engineered for wireless base station applications, featuring advanced manufacturing processes and strict quality controls to ensure reliable high-frequency signal transmission.

Key Specifications

Layer Count	6 Layers
Material	FR4 TG150
Board Thickness	1.2mm
Copper Thickness	1/0.5/0.5/1 oz
Minimum Hole Size	0.2mm
Minimum Line Width	0.12mm
Minimum Line Spacing	0.12mm
Solder Mask Color	White
Surface Finish	ENIG (Electroless Nickel Immersion Gold)
Application Field	Communication Module

Manufacturing Process Highlights

LDI Pattern Transfer: Laser Direct Imaging ensures ±10% line width tolerance control
Vacuum Lamination: Eliminates dry film bubbles during production
AOI Inspection: Automated Optical Inspection detects undercuts and shorts post-etching
Precision Lamination: Controlled temperature ramp rate (1.5-2.5°C/min) prevents glass fiber slippage
Advanced Drilling: Coated drill bits with backup board structures minimize hole wall burrs
ENIG Finish: Plasma cleaning and micro-etching with nickel (3-6μm) and gold (0.05-0.1μm) layer control
100% Electrical Testing: Flying probe or universal fixture testing ensures opens/shorts detection

Technical Capabilities

Item	Mass Production Capability	Extreme Capability
Board Thickness Range	0.3~6.0mm	0.3~6.0mm
Exposure Alignment Accuracy	±0.015mm	±0.005mm
Minimum Annular Ring	Single side ≥0.05mm	Single side ≥0.05mm
Min Line Width/Space (1/3oz base copper)	0.05mm / 0.05mm	0.045mm / 0.045mm
Min Line Width/Space (1/2oz base copper)	0.05mm / 0.05mm	0.05mm / 0.05mm
Min Line Width/Space (1oz base copper)	0.075mm / 0.075mm	0.075mm / 0.075mm
Etching Tolerance (1/3oz base copper)	±0.005mm	±0.005mm
Etching Tolerance (1/2oz base copper)	±0.005mm	±0.005mm
Etching Tolerance (1oz base copper)	±0.0075mm	±0.0075mm
Gold Finger Total Pitch Tolerance	<30mm: ±0.05mm 30~60mm: ±0.075mm	<30mm: ±0.03mm 30~60mm: ±0.05mm

Product Tags:

6 Layer Communication Module PCB

ENIG Communication Module PCB

6 Layer Signal Transmission PCB

6 Layer ENIG Communication Module PCB For High Frequency Signal Transmission Images

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