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Multilayer High Frequency Circuit Board PCB Fabrication 1OZ For Electronic Products

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Multilayer High Frequency Circuit Board PCB Fabrication 1OZ For Electronic Products

Name: Multilayer High Frequency Circuit Board PCB Fabrication 1OZ For Electronic Products
Brand: XSW PCB
Price: 1 USD

Model Number : XSWPCB

Material : Fr4

MOQ : 1

Delivery Time : 8-15DAYS

Surface Finish : ENIG

Payment Terms : Western Union

Supply Ability : 1 Million Square feet/per month

Certification : UL ,IOS9000

Board Thickness : 1.5 mm (Customizable)

Place of Origin : China

Copper Thickness : 1/1/1/1/1/1 oz

Price : Negotiable

Brand Name : XSW PCB

Layer Count : 6-Layer

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Multilayer High Frequency Circuit Board PCB Fabrication 1OZ for Electronic Products

Multilayer High Frequency Circuit Board PCB Fabrication 1OZ for Electronic Products is a high-performance PCB solution designed for high-speed signal transmission, RF communication, industrial electronics, networking equipment, automotive systems, and advanced consumer electronics. Featuring a multilayer PCB structure with 1oz copper thickness, this circuit board provides excellent electrical performance, stable impedance control, and reliable signal integrity for demanding electronic applications.

Key Specifications

Layer Count	6-Layer
Material	Fr4
Board Thickness	1.5 mm (Customizable)
Copper Thickness	1/1/1/1/1/1 oz
Minimum Hole Size	0.1 mm
Minimum Line Width	0.1 mm
Minimum Line Spacing	0.1 mm
Solder Mask Color	Green
Surface Finish	ENIG

Product Description

1oz Copper Thickness

Standard 1oz copper for reliable conductivity.
Excellent current-carrying capability.
Suitable for most commercial and industrial applications.

High-Frequency Performance

Optimized for RF and high-speed signal transmission.
Low signal attenuation and transmission loss.
Ideal for communication and networking products.

Controlled Impedance Capability

Precision impedance control for signal-critical circuits.
Improves signal integrity and transmission stability.
Supports high-speed digital and RF applications.

Superior Signal Integrity

Reduced EMI and crosstalk.
Stable electrical performance across multiple layers.
Reliable operation in complex electronic systems.

Advanced PCB Fabrication Technology

High-precision drilling and multilayer lamination.
Accurate layer-to-layer registration.
Consistent manufacturing quality.

Design Specifications

Item	Mass Production Capability	Extreme Capability
Board Thickness Range	0.3~6.0mm	0.3~6.0mm
Exposure Alignment Accuracy	±0.015mm	±0.005mm
Minimum Annular Ring	Single side ≥0.05mm	Single side ≥0.05mm
Min Line Width/Space (1/3oz base copper)	0.05mm / 0.05mm	0.045mm / 0.045mm
Min Line Width/Space (1/2oz base copper)	0.05mm / 0.05mm	0.05mm / 0.05mm
Min Line Width/Space (1oz base copper)	0.075mm / 0.075mm	0.075mm / 0.075mm
Etching Tolerance (1/3oz base copper)	±0.005mm	±0.005mm
Etching Tolerance (1/2oz base copper)	±0.005mm	±0.005mm
Etching Tolerance (1oz base copper)	±0.0075mm	±0.0075mm
Gold Finger Total Pitch Tolerance	<30mm: ±0.05mm 30~60mm: ±0.075mm	<30mm: ±0.03mm 30~60mm: ±0.05mm

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