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OEM Electronics Full Turnkey PCB Assembly Black Thick Copper PCB Board For Power Module

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OEM Electronics Full Turnkey PCB Assembly Black Thick Copper PCB Board For Power Module

Name: OEM Electronics Full Turnkey PCB Assembly Black Thick Copper PCB Board For Power Module
Brand: XSW PCB
Price: 1 USD

Model Number : XSWPCB

Material : PI

MOQ : 1

Delivery Time : 8-15DAYS

Surface Finish : Lead-free soldering

Payment Terms : Western Union

Certification : UL ,IOS9000

Board Thickness : 1.0 mm (Customizable)

Place of Origin : China

Copper Thickness : 6/2/2/2/2/2/2/2/2/2/2/2/2/2/2/6 oz

Supply Ability : 1 Million Square feet/per month

Price : Negotiable

Brand Name : XSW PCB

Layer Count : 16-Layer

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OEM Full Turnkey Black Thick Copper PCB Board Electronics For Power Module

OEM Full Turnkey Black Thick Copper PCB Board Electronics for Power Module is a high-power PCB assembly solution specifically designed for power modules, industrial power supplies, motor drives, renewable energy systems, automotive electronics, and high-current applications. Featuring thick copper circuitry, a black solder mask finish, and complete turnkey PCB manufacturing and assembly services, this PCB delivers exceptional current-carrying capacity, thermal management performance, and long-term operational reliability.

Key Specifications

Layer Count	16-Layer
Material	PI
Board Thickness	1.0 mm (Customizable)
Copper Thickness	6/2/2/2/2/2/2/2/2/2/2/2/2/2/2/6 oz
Minimum Hole Size	0.1 mm
Minimum Line Width	0.1 mm
Minimum Line Spacing	0.1 mm
Solder Mask Color	Black
Surface Finish	Lead-free soldering

Product Description

Premium Polyimide Substrate Material

Excellent thermal resistance and dimensional stability.
Superior performance in high-temperature environments.
Ideal for aerospace, automotive, and industrial applications.

Thick Copper Technology

Enhanced current-carrying capability.
Reduced conductor resistance and voltage drop.
Suitable for high-power electronic systems.

Multilayer PCB Construction

Supports complex circuit architectures.
Improved signal routing and power distribution.
High-density design capability.

Outstanding Thermal Management

Efficient heat dissipation for power-intensive applications.
Improved reliability under continuous operation.
Reduced thermal stress on components.

Design Specifications

Item	Mass Production Capability	Extreme Capability
Board Thickness Range	0.3~6.0mm	0.3~6.0mm
Exposure Alignment Accuracy	±0.015mm	±0.005mm
Minimum Annular Ring	Single side ≥0.05mm	Single side ≥0.05mm
Min Line Width/Space (1/3oz base copper)	0.05mm / 0.05mm	0.045mm / 0.045mm
Min Line Width/Space (1/2oz base copper)	0.05mm / 0.05mm	0.05mm / 0.05mm
Min Line Width/Space (1oz base copper)	0.075mm / 0.075mm	0.075mm / 0.075mm
Etching Tolerance (1/3oz base copper)	±0.005mm	±0.005mm
Etching Tolerance (1/2oz base copper)	±0.005mm	±0.005mm
Etching Tolerance (1oz base copper)	±0.0075mm	±0.0075mm
Gold Finger Total Pitch Tolerance	<30mm: ±0.05mm 30~60mm: ±0.075mm	<30mm: ±0.03mm 30~60mm: ±0.05mm

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