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ENIG Multilayer Network Server PCB FR4 TG150 6 Layer HDI PCB Board

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ENIG Multilayer Network Server PCB FR4 TG150 6 Layer HDI PCB Board

Name: ENIG Multilayer Network Server PCB FR4 TG150 6 Layer HDI PCB Board
Brand: XSW PCB
Price: 1 USD

Model Number : XSWPCB

Material : FR4 TG150

MOQ : 1

Delivery Time : 8-15DAYS

Surface Finish : ENIG

Payment Terms : Western Union

Certification : UL ,IOS9000

Board Thickness : 1.6 mm (Customizable)

Place of Origin : China

Copper Thickness : 1/1/1/1/1/1 oz

Supply Ability : 1 Million Square feet/per month

Price : Negotiable

Brand Name : XSW PCB

Layer Count : 6L

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ENIG Multilayer PCB Board Network Server Hdi Multilayer Pcb

The ENIG Multilayer PCB Board for Network Server is a high-density interconnect (HDI) PCB solution designed for servers, data centers, cloud computing platforms, storage systems, and advanced networking equipment. Featuring a multilayer HDI structure and premium ENIG (Electroless Nickel Immersion Gold) surface finish, this PCB delivers exceptional signal integrity, high routing density, and superior reliability for high-speed digital applications.

Engineered to support modern server architectures, the HDI PCB utilizes fine-line circuitry, microvias, blind vias, and buried vias to maximize circuit density while minimizing board size. The ENIG surface finish provides excellent solderability, flatness, and corrosion resistance, making it ideal for BGA, CSP, and other fine-pitch components commonly used in server and networking hardware.

Key Specifications

Layer Count	6-Layer
Material	FR4 TG150
Board Thickness	1.6 mm (Customizable)
Copper Thickness	1/1/1/1/1/1 oz
Minimum Hole Size	0.25 mm
Minimum Line Width	0.1 mm
Minimum Line Spacing	0.1 mm
Solder Mask Color	Green
Surface Finish	ENIG

Product Description

Advanced HDI Multilayer Design
- Supports high-density component placement and complex circuit routing.
- Enables compact and high-performance server motherboard designs.
Premium ENIG Surface Finish
- Provides excellent solderability and superior surface flatness.
- Enhances corrosion resistance and long-term reliability.
Optimized for Network Server Applications
- Designed for servers, storage systems, network switches, routers, and cloud computing equipment.
- Supports continuous high-speed data processing and transmission.
Excellent Signal Integrity
- Controlled impedance routing minimizes signal loss, crosstalk, and reflection.
- Suitable for high-speed interfaces and networking protocols.

Design Specifications

Item	Mass Production Capability	Extreme Capability
Board Thickness Range	0.3~6.0mm	0.3~6.0mm
Exposure Alignment Accuracy	±0.015mm	±0.005mm
Minimum Annular Ring	Single side ≥0.05mm	Single side ≥0.05mm
Min Line Width/Space (1/3oz base copper)	0.05mm / 0.05mm	0.045mm / 0.045mm
Min Line Width/Space (1/2oz base copper)	0.05mm / 0.05mm	0.05mm / 0.05mm
Min Line Width/Space (1oz base copper)	0.075mm / 0.075mm	0.075mm / 0.075mm
Etching Tolerance (1/3oz base copper)	±0.005mm	±0.005mm
Etching Tolerance (1/2oz base copper)	±0.005mm	±0.005mm
Etching Tolerance (1oz base copper)	±0.0075mm	±0.0075mm
Gold Finger Total Pitch Tolerance	<30mm: ±0.05mm 30~60mm: ±0.075mm	<30mm: ±0.03mm 30~60mm: ±0.05mm

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