Home > Server PCB >

4 Layers Multilayer Metal Core PCB Manufacturer For Network Server

Product Categories

Single Layer Printed Circuit Board [10]
Double Layer Printed Circuit Board [10]
Multilayer Printed Circuit Board [17]
HDI Printed Circuit Board [10]
High Frequency Printed Circuit Board [12]
Server PCB [8]
Communication PCB [14]
Industrial Control PCB [10]
Copper Substrate PCB [2]
Medical Circuit Board [6]
Automotive Printed Circuit Board [6]
Drone PCB Board [5]
5G Optical Module PCB [5]
Radio Frequency PCB [5]

Shenzhen Xunsiwei Circuit Co., Ltd.

Trust Seal

Verified Supplier

Credit Check

Supplier Assessment

Contact Now

4 Layers Multilayer Metal Core PCB Manufacturer For Network Server

Name: 4 Layers Multilayer Metal Core PCB Manufacturer For Network Server
Brand: XSW PCB
Price: 1 USD

Model Number : XSWPCB

Material : FR4

MOQ : 1

Delivery Time : 8-15DAYS

Surface Finish : Lead-free soldering

Payment Terms : Western Union

Supply Ability : 1 Million Square feet/per month

Certification : UL ,IOS9000

Board Thickness : 3.0 mm (Customizable)

Place of Origin : China

Copper Thickness : 1/1/1/1 oz

Price : Negotiable

Brand Name : XSW PCB

Layer Count : 4-Layer

Contact Now

4 Layers Multilayer Metal Core Pcb Network Server ODM

The 4 Layers Multilayer Metal Core PCB for Network Server ODM is engineered for high-performance server systems, network communication equipment, data centers, and cloud computing infrastructure. Combining a robust 4-layer circuit structure with a metal core substrate, this PCB delivers superior thermal management, excellent mechanical stability, and reliable high-speed signal transmission for demanding networking applications.

Key Specifications

Layer Count	4L
Material	FR4
Board Thickness	3.0 mm (Customizable)
Copper Thickness	1/1/1/1 oz
Minimum Hole Size	0.25 mm
Minimum Line Width	0.1 mm
Minimum Line Spacing	0.1 mm
Solder Mask Color	Green
Surface Finish	Lead-free soldering

Product Description

4-Layer Multilayer PCB Structure
- Provides dedicated signal, power, and ground layers for improved circuit performance.
- Supports complex server and networking system designs.
Metal Core Thermal Management
- Excellent heat dissipation capability compared with conventional FR4 PCBs.
- Helps maintain stable operating temperatures for high-power components.
Optimized for Network Server Applications
- Designed for servers, switches, routers, storage systems, and communication equipment.
- Supports continuous 24/7 operation in data-intensive environments.
High-Speed Signal Integrity
- Controlled impedance routing minimizes signal loss and crosstalk.
- Suitable for high-speed networking and data transmission applications.
Superior Mechanical Strength
- Metal core construction enhances rigidity and structural stability.
- Resistant to warpage and thermal deformation.

Design Specifications

Item	Mass Production Capability	Extreme Capability
Board Thickness Range	0.3~6.0mm	0.3~6.0mm
Exposure Alignment Accuracy	±0.015mm	±0.005mm
Minimum Annular Ring	Single side ≥0.05mm	Single side ≥0.05mm
Min Line Width/Space (1/3oz base copper)	0.05mm / 0.05mm	0.045mm / 0.045mm
Min Line Width/Space (1/2oz base copper)	0.05mm / 0.05mm	0.05mm / 0.05mm
Min Line Width/Space (1oz base copper)	0.075mm / 0.075mm	0.075mm / 0.075mm
Etching Tolerance (1/3oz base copper)	±0.005mm	±0.005mm
Etching Tolerance (1/2oz base copper)	±0.005mm	±0.005mm
Etching Tolerance (1oz base copper)	±0.0075mm	±0.0075mm
Gold Finger Total Pitch Tolerance	<30mm: ±0.05mm 30~60mm: ±0.075mm	<30mm: ±0.03mm 30~60mm: ±0.05mm

Product Tags: