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Network Server PCB 6 Layer 1.6mm Thickness Multilayer PCB Board

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Network Server PCB 6 Layer 1.6mm Thickness Multilayer PCB Board

Name: Network Server PCB 6 Layer 16mm Thickness Multilayer PCB Board
Brand: XSW PCB
Price: 1 USD

Model Number : XSWPCB

Material : FR4

MOQ : 1

Delivery Time : 8-15DAYS

Surface Finish : Green

Payment Terms : Western Union

Supply Ability : 1 Million Square feet/per month

Certification : UL ,IOS9000

Board Thickness : 1.6 mm (Customizable)

Place of Origin : China

Copper Thickness : 1/1/1/1/1/1 oz

Price : Negotiable

Brand Name : XSW PCB

Layer Count : 6-Layer

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1.6 mm Board Thickness 6 Layer Multilayer Pcb Network Server PCB

The 1.6 mm Board Thickness 6 Layer Multilayer PCB is designed for network servers, data communication equipment, storage systems, and high-speed computing applications. Built with a six-layer stack-up structure, this PCB provides excellent signal integrity, stable power distribution, and enhanced EMI suppression for demanding networking environments. Manufactured using high-quality FR-4 materials and advanced PCB fabrication processes, it supports high-density component layouts and reliable long-term operation in enterprise-grade server systems.

Key Specifications

Layer Count	6-Layer
Material	FR4
Board Thickness	1.6 mm (Customizable)
Copper Thickness	1/1/1/1/1/1 oz
Minimum Hole Size	0.25 mm
Minimum Line Width	0.1 mm
Minimum Line Spacing	0.1 mm
Solder Mask Color	Green
Surface Finish	ENIG

Product Description

6-Layer Multilayer Design
- Optimized routing for high-speed signals and complex network architectures.
- Supports dense component placement and advanced server motherboard layouts.
Standard 1.6 mm Board Thickness
- Provides excellent mechanical strength and dimensional stability.
- Compatible with industry-standard server and networking equipment.
Superior Signal Integrity
- Controlled impedance design for high-frequency data transmission.
- Reduces signal loss, crosstalk, and transmission errors.
Reliable Power Distribution
- Dedicated power and ground planes improve voltage stability.
- Supports high-performance processors, memory modules, and communication chips.
Enhanced EMI/EMC Performance
- Multilayer stack-up structure minimizes electromagnetic interference.
- Suitable for high-speed Ethernet, cloud computing, and data center applications.
High Manufacturing Precision
- Supports fine line widths, small vias, and high-density interconnect layouts.
- Ideal for advanced networking and server hardware designs.

Design Specifications

Item	Mass Production Capability	Extreme Capability
Board Thickness Range	0.3~6.0mm	0.3~6.0mm
Exposure Alignment Accuracy	±0.015mm	±0.005mm
Minimum Annular Ring	Single side ≥0.05mm	Single side ≥0.05mm
Min Line Width/Space (1/3oz base copper)	0.05mm / 0.05mm	0.045mm / 0.045mm
Min Line Width/Space (1/2oz base copper)	0.05mm / 0.05mm	0.05mm / 0.05mm
Min Line Width/Space (1oz base copper)	0.075mm / 0.075mm	0.075mm / 0.075mm
Etching Tolerance (1/3oz base copper)	±0.005mm	±0.005mm
Etching Tolerance (1/2oz base copper)	±0.005mm	±0.005mm
Etching Tolerance (1oz base copper)	±0.0075mm	±0.0075mm
Gold Finger Total Pitch Tolerance	<30mm: ±0.05mm 30~60mm: ±0.075mm	<30mm: ±0.03mm 30~60mm: ±0.05mm

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